• Two 168-pin dual inline memory module (DIMM) sockets
• Support for up to 512-megabytes (MB) of 100-megahertz (MHz) or 133-MHz, non-ECC, unbuffered synchronous dynamic RAM (SDRAM)
  • 16-MB to 256-MB using 16, 32, or 128-megabit (Mb) technology

    Note: The type of Megabit technology refers to the density of each DRAM chip located on the DIMM. For instance, each DRAM chip on a 128-Mb based DIMM is 16 megabytes (MB) in size. This motherboard will not accept DIMMS based on higher than 128 Mb technology.

• Support for Serial Presence Detect (SPD) and non-SPD DIMMs

• Intel® Pentium® III processor in a 370-pin Plastic Pin Grid Array (PPGA) socket with 66/100-MHz host bus speed
• Intel Celeron™ processor in a 370-pin PPGA socket with 66/100-MHz host bus speed

• Intel 82810E GMCH (Graphics/Memory Controller Hub)
  • Digital Visual Interface (DVI) header for optional card to support Flat Panel, Digital CRT or TV out
  • Interface to ICH2 via the Accelerated Hub Architecture (AHA) interface for I/O support
  • Integrated Video with AGP interface
    • Integrated 2D and 3D graphics engines
    • Integrated Hardware motion compensation engine
    • Complies with AGP specification revision 2.0
• Intel 82810E ICH (I/O Controller Hub)
  • Universal Serial Bus
    • UHCI Implementation with four ports
    • Supports Wake from sleep states S1, S3, and S4.
    • Supports legacy Keyboard/Mouse software
• Intel 82810E FWH (Firmware Hub)

• SMSC LPC47M102 low pin count (LPC) interface super I/O controller
• UATA 33/66

• Two half-height 32-bit busmaster PCI v2.2 slots
• Supports 3.3-V to 5-V bus interface

• Meets ACPI specifications
• Power switch connector on-board
• Soft power off

• Operating: 0° to +55° C (32° to +133° F)
• Non-Operating: -40° to +70° C (-40° to +158° F)

Note: An ambient temperature that exceeds the board's maximum operating temperature by 5 to 10°C might cause components to exceed their maximum case temperature.