Specifications
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Following are the specifications for the motherboard.
Specifications are subject to change without notice or obligation.

Feature Specification
BIOS AMI BIOS
RAM Capacity
  • Two 168-pin dual inline memory module (DIMM) sockets
  • Support for up to 512-megabytes (MB) of 100-megahertz (MHz), non-ECC, unbuffered synchronous dynamic RAM (SDRAM)
    • 32-MB to 256-MB using 16 Mbit/64 Mbit technology
    • 512-MB maximum using 128 Mbit technology
  • Support for Serial Presence Detect (SPD) and non-SPD DIMMs
Processor Host Bus Speed
  • Intel® Pentium® III processor in a 370-pin Plastic Pin Grid Array (PPGA) socket with 66/100-MHz host bus speed
  • Intel Celeron™ processor in a 370-pin PPGA socket with 66/100-MHz host bus speed
Chipset The Intel 810L chipset consisting of:
  • Intel 82810L GMCH (Graphics/Memory Controller Hub)
  • Intel 82801AA ICH (I/O Controller Hub)
  • Intel 82802AB FWH (Firmware Hub)
On-Board IDE
  • SMSC LPC47M102 low pin count (LPC) interface super I/O controller
  • UATA 33
Slots
  • Four 32-bit master PCI bus slots
  • Supports 3.3-V to 5-V bus interface
Remote Control
  • Meets ACPI specifications
  • Power switch connector on-board
  • Soft power off
  • Supports LAN wake up
Temperature
  • Operating: 0°C to +55°C (32°F to +133°F)
  • Non-Operating: -40°C to +70°C (-40°F to +158°F)

Note: An ambient temperature that exceeds the board's maximum operating temperature by 5 to 10°C might cause components to exceed their maximum case temperature.
Reliability The Mean Time Between Failures (MTBF) is 293,919 hours, at 55°C (133°F).